Discovering new fabrics for copper/low-k interconnects is necessary to the ongoing improvement of machine chips. whereas copper/low-k interconnects have served good, taking into account the production of extremely huge Scale Integration (ULSI) units which mix over one billion transistors onto a unmarried chip, the elevated resistance and RC-delay on the smaller scale has develop into a major factor affecting chip functionality.
Advanced Interconnects for ULSI Technology is devoted to the fabrics and techniques that may be compatible replacements. It covers a extensive variety of themes, from actual ideas to layout, fabrication, characterization, and alertness of latest fabrics for nano-interconnects, and discusses:
- Interconnect capabilities, characterisations, electric homes and wiring requirements
- Low-k fabrics: basics, advances and mechanical properties
- Conductive layers and barriers
- Integration and reliability together with mechanical reliability, electromigration and electric breakdown
- New ways together with 3D, optical, instant interchip, and carbon-based interconnects
Intended for postgraduate scholars and researchers, in academia and undefined, this e-book presents a severe review of the permitting know-how on the center of the long run improvement of laptop chips.
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