This booklet will introduce new concepts for detecting and diagnosing small-delay defects in built-in circuits. even though this type of timing illness is often present in built-in circuits synthetic with nanometer expertise, it will be the 1st publication to introduce powerful and scalable methodologies for screening and diagnosing small-delay defects, together with very important parameters corresponding to technique diversifications, crosstalk, and tool offer noise.

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10. 2. 1 Static Fault analysis . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . 10. 2. 2 Dynamic Fault analysis . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . 10. 2. three Inject-and-Evaluate strategy .. . . . . . . .. . . . . . . . . . . . . . . . . . . . 10. three analysis of test Chain .. . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . 10. three. 1 initial experiment Chain prognosis . . . .. . . . . . . . . . . . . . . . . . . . 10. three. 2 Hardware-Assisted analysis .. . . . . . . . .. . . . . . . . . . . . . . . . . . . . 10. three. three Inject-and-Evaluate test Chain prognosis .. . . . . . . . . . . . . . . 10. four Chip-Level analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . References .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . one hundred seventy five a hundred seventy five 176 176 178 181 185 185 186 188 191 191 eleven Diagnosing Noise-Induced SDDs through the use of Dynamic SDF . . . . . . . . . . . . . eleven. 1 advent .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 1. 1 ideas for Timing research . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 1. 2 previous paintings on PSN and Crosstalk . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 1. three bankruptcy Contents and Organization.. . .. . . . . . . . . . . . . . . . . . . . eleven. 2 IR-Drop research. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. three IR2Delay Database .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. three. 1 Transition research . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. three. 2 using power research . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. three. three energy Voltage-Delay Map . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. four Mixed-Signal Simulation-Based Validation.. . . .. . . . . . . . . . . . . . . . . . . . eleven. four. 1 Mixed-Signal Simulation .. . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. four. 2 Simulation effects Extraction . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. five Experimental effects on IR2Delay Database Validation .. . . . . . . . . . eleven. five. 1 Experimental Setup .. . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. five. 2 comparability with Full-Circuit SPICE Simulation .. . . . . . . . eleven. five. three Complexity research . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 6 prognosis for Failure Paths . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 7 Experimental effects on Diagnosing IR-Drop SDDs . . . . . . . . . . . . . . eleven. 7. 1 analysis movement and Experimental Setup .. . . . . . . . . . . . . . . . . eleven. 7. 2 Circuit functionality in Presence of IR Drop .. . . . . . . . . . . . . eleven. 7. three mess ups from IR Drop .. . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . eleven. 7. four Timing-Aware IR-Drop analysis .. . . .. . . . . . . . . . . . . . . . . . . . eleven. eight Summary.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . References .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . . . . . . . . . . . . 193 193 193 194 194 195 197 197 199 201 202 202 204 205 205 205 207 207 208 208 209 209 210 211 212 Acronyms ALAPTF ASIC ATE ATPG BIST CF CLT CMOS CPU CUD lower DC DDP DDPM DEF DFF DFM DFT DPM DS DSPF DTC DTPG DUT EDA EMD FCFI GB HB IC IEEE As overdue as attainable transition program particular built-in circuit automated attempt gear automated try development new release integrated self-test severe fault crucial restrict theorem Complementary steel oxide semiconductor significant processing unit Circuit lower than analysis Circuit less than attempt layout Compiler hold up disorder chance hold up illness likelihood matrix layout alternate structure information flip-flop Design-for-manufacturability layout for attempt faulty components in line with million Detected through simulation distinct average parasitic structure hold up attempt insurance Diagnostic try out trend new release layout lower than attempt digital layout automation Embedded multi-detection First come first effect Gigabyte Hybrid strategy built-in circuit Institute of electric and electronics engineers xvii xviii IP IWLS LOC LOS LP LPthr MB NLDM PDF PDN PI PLL PO PPSFP PSN PV PVT PathDF RTL SCAP SDD SDF SDQL SDQM SE SI SLAT SLthr SOC SP SPEF SRC SSTA STA STAFAN TA TDF TF TPG TPI VCD VDSM VLSI VLV Acronyms Intermediate course foreign workshop on good judgment and synthesis Launch-on-capture Launch-on-shift lengthy direction lengthy course threshold Megabyte Non-linear hold up version likelihood density functionality energy distribution community fundamental enter section locked loop fundamental output Parallel-pattern single-fault propagation energy provide noise technique edition Process-voltage-temperature direction hold up fault Register-transfer point Switching cycle regular strength Small-delay illness commonplace hold up layout Statistical hold up caliber point Statistical hold up caliber version experiment let sign integrity unmarried position at-a-time Slack threshold method on chip brief direction typical parasitic trade structure Semiconductor study company Statistical static-timing research Static-timing research Statistical fault research Timing-aware Transition-delay fault overall fault try out development generator try element insertion price switch sell off Very deep sub-micron Very huge scale integration Very-low-voltage Chapter 1 creation to VLSI trying out as a result complicated mechanical and chemical steps excited by today’s production methods, inaccuracy and imperfections might be brought to the fabricated chips or built-in circuits (ICs), and accordingly they might not manage to practice precisely because the layout specification meant.

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